2026-04-22 06:22:07
SK Hynix to Invest $12.85B in Advanced AI Memory Packaging Plant in South Korea
SK Hynix plans a Cheongju HBM packaging plant (P&T7) covering ~231,400 m2 with 19T won, plus a 2025 expansion of 20T won; co-located wafer/packaging as part of a three-site strategy including Indiana and ASML orders.
Abstract: SK Hynix announced a major investment to build a large HBM packaging facility in Cheongju (P&T7), co-located with wafer production, as part of a three-site packaging strategy that includes an Indiana hub and substantial ASML equipment orders to meet rising AI memory demand.