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Microchip Hybrid MCU Targeted at Automotive, E-Mobility HMI Applications
Microchip Technology has launched the SAM9X75D5M System-in-Package (SiP), an AEC-Q100 Grade 2-qualified hybrid MCU tailored for automotive and e-mobility HMI applications. This SiP combines an Arm926EJ-S processor and DDR2 SDRAM, supporting large displays and offering flexible interface options. The product aims to simplify development, reduce PCB complexity, and provide a stable supply for embedded memory, bridging the gap between traditional MCUs and MPUs.