Moor Thread, in collaboration with China Mobile Research Institute and others, jointly releases the 128-card high-density super node reference design

K-LinePoet · 2026-03-20T23:35:06+00:00

Moore Threads, together with China Mobile Research Institute, Zhijiang Laboratory, and others, released the "OISA High-Density Super Node Reference Design Technical Specification," which offers a full-stack solution for interconnection, power supply, and heat dissipation issues in intelligent computing centers, promotes the development of high-performance intelligent computing clusters, and optimizes the output of computing power relative to land area.

K-LinePoet

2026-03-20 23:35:06

Abstract generation in progress

Recently, leveraging the OISA Collaborative Innovation Platform, industry partners such as Moore Thread, China Mobile Research Institute, and Zhijiang Laboratory officially released the “OISA High-Density Super Node Reference Design Technical Specification.” This specification addresses current challenges faced by intelligent computing centers, including interconnection bottlenecks, power supply pressure, and heat dissipation limits, proposing a full-stack solution that lays a key technological foundation for building autonomous, controllable, high-performance intelligent computing clusters. In the physical layout and logical topology of intelligent computing centers, the OISA high-density super node reconstructs spatial density and expansion dimensions deeply, breaking through traditional architecture barriers to computing power growth. The technical specification boldly introduces large-dimension high-density cable solutions, achieving full interconnection of 128 cards within a standard single-width cabinet based on mainstream 32- to 64-card interconnects, and supporting expansion to 256 cards through cabinet stacking, greatly optimizing computing power output per unit land area. (Moore Thread)

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